|                   |  Pn、P35 CMP Pad Conditioner
 
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      化學共價鍵結合,鑽石永不脫落 低溫燒結(750℃),不會破壞鑽石的結晶體,導致鑽石剝落(peeling),造成晶圓刮傷(scratch) 低溫燒結,鑽石結晶強度完整,不用break-in,可增加使用壽命(life time),降低break-in的時間成本 鑽石的高低(大小)誤差值25μm(量測20點的平均值) 生產工業鑽石工具已有30年的經驗,無論在品質產品的穩定上,都有相當的水準 國內自製生產(Maker),價格具競爭力 Chemical  covalent bond , No diamond lossLow  temperature(750℃), the crystal of diamond is flawless , so  as to prevent diamond peeling and scratch wafer.Diamond  tolerance 25μm  ( average height of 20 points ) Don’t  break-in , increase life time and is a maker so most competitive. | 
    
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      高溫燒結,會破鑽石的結晶體,導致鑽石剝落(peeling)造成晶圓刮(scratch)高溫燒結,鑽石太圓,不利於pad修整 高溫燒結,鑽石晶體已被破壞,所以一定要break-in.時間愈長,造成晶圓刮傷(scratch)比率愈少.鑽石的大小落差太大,造成pad修整平質不良,影響晶圓平坦化的品質,乃致於影響IC成品的良率 High  temperature, diamond peeling and scratch wafer.High  temperature, diamond is blocky, so unstable R.R , U% and lifetime. | 
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      鑽石與Ni沒有共價鍵結合,鑽石易脫落,會刮傷晶圓 電鑄鑽石容易重疊 Electroplated  is not chemical covalent bond , diamond loss could scratch wafer.Electroplated  , diamond overlap easily. | 
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      PCD硬度較單晶鑽石差 PCD壽命較單晶鑽石差 Mono  crystal diamond hardness than PCDMono  crystal diamond longer lifetime than PCD | 
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