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Pn、P35
CMP Pad Conditioner
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- 化學共價鍵結合,鑽石永不脫落
- 低溫燒結(750℃),不會破壞鑽石的結晶體,導致鑽石剝落(peeling),造成晶圓刮傷(scratch)
- 低溫燒結,鑽石結晶強度完整,不用break-in,可增加使用壽命(life time),降低break-in的時間成本
- 鑽石的高低(大小)誤差值25μm(量測20點的平均值)
- 生產工業鑽石工具已有30年的經驗,無論在品質產品的穩定上,都有相當的水準
- 國內自製生產(Maker),價格具競爭力
- Chemical covalent bond , No diamond loss
- Low temperature(750℃), the crystal of diamond is flawless , so as to prevent diamond peeling and scratch wafer.
- Diamond tolerance 25μm ( average height of 20 points )
- Don’t break-in , increase life time and is a maker so most competitive.
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- 高溫燒結,會破鑽石的結晶體,導致鑽石剝落(peeling)造成晶圓刮(scratch)
- 高溫燒結,鑽石太圓,不利於pad修整
- 高溫燒結,鑽石晶體已被破壞,所以一定要break-in.時間愈長,造成晶圓刮傷(scratch)比率愈少.
- 鑽石的大小落差太大,造成pad修整平質不良,影響晶圓平坦化的品質,乃致於影響IC成品的良率
- High temperature, diamond peeling and scratch wafer.
- High temperature, diamond is blocky, so unstable R.R , U% and lifetime.
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- 鑽石與Ni沒有共價鍵結合,鑽石易脫落,會刮傷晶圓
- 電鑄鑽石容易重疊
- Electroplated is not chemical covalent bond , diamond loss could scratch wafer.
- Electroplated , diamond overlap easily.
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- PCD硬度較單晶鑽石差
- PCD壽命較單晶鑽石差
- Mono crystal diamond hardness than PCD
- Mono crystal diamond longer lifetime than PCD
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